Crystal | |
---|---|
1.1 Growing Method | MOCVD |
1.2 Orientation | <111> crystal orientation |
1.3 thickness | 5~5.5um |
1.4 Surface coverage/thickness | GaN /2-2.5nm |
1.5GaN quality | <600”(002 ) |
<1000”(102) | |
1.6 HEMT component |
AlxGal-xN,0.2 |
1.7 ALN intermediate layer | 1-2nm |
Electrical | |
Two-dimensional electron gas concentration of HEMT structure | >8E12/cm² |
Mechanical | |
Diameter | 150±0.2mm |
Surface Treatment | |
Crack (Edge 5 mm) | without |
Surface Treatment | |
---|---|
Crack (Edge 5 mm) | without |